Model No.: HDI PCB Boards
Type: Rigid Circuit Board
Application: Medical Instruments
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Metal Composite Materials
HDI PCB Boards: HDI PCB Circuit Boards
HDI BOARDS – HIGH DENSITY INTERCONNECT
Topscom is a professional printed circuit boards manufacturer,include: Pcb Circuit Boards Manufacturing,Multilayer Rigid Pcb,High Frequency Pcb,Aluminum Pcb,Led Pcb,Thick Copper Pcb,High-TG Pcb,Halogen-Free Pcb,HDI Pcb,Flexible Pcb,Rigid-Flexible Pcb,pcb assembly,oem manufacturing,electronic contract manufacturing.HDI boards, one of the fastest growing technologies in PCBs, are now available at Topscom. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
HDI – High Density Interconnect PCB
Printed Circuit Board Using HDI Technology
Consumer Driven Technology
The via-in-pad process supports more technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.
HDI Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.
Key HDI Benefits
As consumer demands change, so must technology. By using HDI technology, designers now have the option to place more components on both sides of the raw PCB. Multiple via processes, including via in pad and blind via technology, allow designers more PCB real estate to place components that are smaller even closer together. Decreased component size and pitch allow for more I/O in smaller geometries. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.
Via in Pad Process
Inspiration from surface mount technologies from the late 1980's has pushed the limits with BGA's, COB and CSP into smaller square surface inches. The via in pad process allows for vias to be placed within the surface of the flat lands. The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over, making it virtually invisible.
Sounds simple but there is an average of eight additional steps to complete this unique process. Specialty equipment and trained technicians follow the process closely to achieve the perfect hidden via.
Via Fill Types
There are many different types of via fill material: non conductive epoxy, conductive epoxy, copper filled, silver filled and electrochemical plating. These all result in a via buried within a flat land that will completely solders as normal lands. Vias and microvias are drilled, blind or buried, filled then plated and hidden beneath SMT lands. Processing vias of this type requires special equipment and is time consuming. The multiple drill cycles and controlled depth drilling adds to process time.
Cost Effective HDI
While some consumer products shrink down in size, quality remains the most important factor for the consumer second to price. Using HDI technology during design, it is possible to reduce an 8 layer through-hole PCB to a 4 layer HDI microvia technology packed PCB. The wiring capabilities of a well-designed HDI 4 layer PCB can achieve the same or better functions as that of a standard 8 layer PCB.
Although the microvia process increases the cost of the HDI PCB, the proper design and reduction in layer count reduces cost in material square inches and layer count more significantly.
Building Non-Conventional HDI Boards
Successful manufacturing of HDI PCBs requires special equipment and processes such as laser drills, plugging, laser direct imaging and sequential lamination cycles. HDI boards have thinner lines, tighter spacing and tighter annular ring, and use thinner specialty materials. In order to successfully produce this type of board, it requires additional time and a significant investment in manufacturing processes and equipment.
Laser Drill Technology
Drilling the smallest of micro-vias allows for more technology on the board's surface. Using a beam of light 20 microns (1 Mil) in diameter, this high influence beam can cut through metal and glass creating the tiny via hole. New products exist such as uniform glass materials that are a low loss laminate and low dielectric constant. These materials have higher heat resistance for lead free assembly and allow for the smaller holes to be used.
Lamination & Materials For HDI Boards
Advanced multilayer technology allows for designers to sequentially add additional pairs of layers to form a multilayer PCB. The use of a laser drill to produce holes in the internal layers allows for plating, imaging and etching prior to pressing. This added process is known as sequential build up. SBU fabrication uses solid filled vias allowing for better thermal management, a stronger inter connect and increasing the board's reliability.
Resin coated copper was developed specifically to aide with poor hole quality, longer drill times and to allow for thinner PCBs. RCC has an ultra-low profile and ultra-thin copper foil that is anchored with minuscule nodules to the surface. This material is chemically treated and primed for the thinnest and finest line and spacing technology.
The application of dry resist to the laminate still uses heated roll method to apply the resist to core material. This older technology process, it is now recommended to preheat the material to a desired temperature prior to the lamination process for HDI printed circuit boards. The preheating of the material allows for better a steady application of the dry resist to the surface of the laminate, pulling less heat away from the hot rolls and allowing for consistent stable exit temperatures of the laminated product. Consistent entrance and exit temperatures lead to less air entrapment beneath the film; this is critical to the reproduction of fine lines and spacing.
LDI & Contact Imagery
Imaging finer lines than ever before and using semiconductor Class 100 Clean rooms to process these HDI parts is costly but necessary. Finer lines, spacing and annular ring requires much tighter controls. With use of finer lines, touch up rework or repair becomes an impossible task. Photo tool quality, laminate prep and imaging parameters are necessary for successful process. Using a clean room atmosphere decreases defects. Dry film resist is still the number one process for all technology boards.
Contact imaging is still widely used due to cost of laser direct imaging; however, LDI is a far better option for such fine lines and spacing. Currently most factories still use contact imaging in a SC100 room. As the demand expands, so does the need for laser drilling and laser direct imaging. All of Topscom's HDI production facilities use the latest in technology equipment to produce this advanced PCB.
Products such as cameras, laptops, scanners and cell phones will continue to push technology to smaller and lighter requirements for the consumer's daily use. In 1992, the average cell phone weighed 220-250 grams and was strictly for making phone calls; we now call, text, surf the net, play our favorite songs or games and take pictures and videos on one tiny device weighing 151grams. Our changing culture will continue to drive HDI technology and Topscom will be here to continue to support our customer needs.
Topscom is a leading Electronics Manufacturing Services (EMS) and pcba assembly provider focused on delivering excellent manufacturing services to automotive, industrial, medical, consumer, telecom, aerospace and technology companies in china. With fiscal year 2016 revenues of USD$80 Million and totally employees about more than 1000, Topscom helps customers build, ship, and service electronics products which provides customers with complete engineering, supply chain service, testing, and manufacturing resources that are vertically integrated with components to optimize their operations by lowering their costs and reducing their time to markets.
Topscom provide an extensive turnkey service range of fabrication, engineering and machining services, including pcb fabrication, pcb assembly,electro-mechancial assembly,mechanical tooling manufacturing,plastic injection molding, metal stamping,die-casting,final box build assembly and full system integration,function testing, burn in ,and custom fabrication etc.
Topscom helps manufacturers of low to medium volume and high volume, high complexity Electronics products focus on the core activities that deliver value to them. We provide complete outsourced manufacturing solutions, provides customers with complete engineering, testing services, and manufacturing resources that are vertically integrated with components to optimize their operations by lowering their costs and reducing their time to markets.
Topscom Provide full-equipped in house Divisions for Your Assurance and try our best to avoid outsourced production to cause the quality faults.
Our different divisions are aligned to provide an extensive range of fabrication, engineering ,testing, and machining services:
· Our pcb boards layout and fabrication devision, Topscom has the ability to build virtually all multilayer board designs produced and Mass production, Multilayer Technologies ,over 70 layer pcb manufacturing capability, High Performance Materials, Buried Capacitance, Hybrid Applications, Buried Resistors. Latest Laminates, HDI, any Layer Via Structures, Multiple Sequential Laminations.
• Our pcb assembly devision,SMT amount capabilities cover 01005.0201, wire bonding and dispensing technologies,lead-free and flip-chip COB COF technologies, spraying conformal coating technologies, Encapsulation and under Fill technologies,12 line high speed Siemens D series production line can meet any quantity requirements.
• Our plastic injection molding division is aligned with advanced equipment in white room and ice water cooling system. A special production line is also built to take out and slice the material grain there.
• Our metal stamping division is equipped with CNC process center, silk machines and drilling machines from Japan and Taiwan.
• our mold tooling division, we use Pro-Engineer professional software for effective design support. Utilizing EROWA grips, we can control the process accuracy within 3ums,try to provide best tooling manufacturing.
• Our Box build Turnkey Assembly and system integration devision, it covers everything from putting a PCBA in a simple enclosure and connecting it to a user interface and display, to a complete machine with tens of thousands of parts and hundreds of sub assemblies.our capability include:Cables and Harnesses assembly,Backplanes,Sub-modules,Complex electro-mechanical assembly Electro-pneumatic assembly,And higher level integration and assembly of high mix, high complexity products.
To keep quality control effective, we continually evaluate our test flow charts. We also maintain procurement offices in Tokyo, Singapore and Hong Kong controlled by our centralized materials warehouse in Shenzhen.
Our manufacturing plant is located in shenzhen, China with a total area of 10000 square meter and over 1000 employees. We strongly believe in the value of our staff and aspire to maintain a professional attitude and corporate culture that fosters creativity and offers job satisfaction.
The management emphasizes continuous training, open communication channel, teamwork and participation in decision-making process.
With substantial experience in cooperating with high-tech companies and diversified customer base in wide product range, we are very confident to provide excellent services, high flexibility, cost effective manufacturing solutions and punctual delivery for our global customer base.
- Company Name: Topscom Technology Co., Ltd.
- Representative: Wuzhixiang
- Product/Service: PCB Assembly , Oem Manufacturing , Pcba , Electronics Contract Manufacturing , Electronics Assembly , PCB Manufacturing
- Capital (Million US $): 10 million usd
- Year Established: 1995
- Total Annual Sales Volume (Million US $): Above US$100 Million
- Export Percentage: 81% - 90%
- Total Annual Purchase Volume (Million US $): US$50 Million - US$100 Million
- No. of Production Lines: above 20
- No. of R&D Staff: 51 -60 People
- No. of QC Staff: 91 -100 People
- OEM Services Provided: yes
- Factory Size (Sq.meters): 10,000-30,000 square meters
- Factory Location: Topscom Building,No.15 Building,SongZiLing Industrial Park,Liantang Industrial City,Shang Village,Gongming,Guangming New District,Shenzhen City,China.
- Contact Person: Mr. Frank Wu
- Tel: 86-0755-22211988
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